According to Marc E. Goldfarb and Robert A. Pucel [45] a
via hole ground in microstrip is a series of a resistance and an
inductance. The given model for a cylindrical via hole has been
verified numerically and experimentally for a range of
.
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(11.232) |
whence is the via length (substrate height) and
the
via's radius.
![]() |
(11.233) |
![]() |
(11.234) |
The relationship for the via resistance can be used as a close
approximation and is valid independent of the ratio of the
metalization thickness to the skin depth. In the formula
denotes the specific resistance of the conductor material.