According to Marc E. Goldfarb and Robert A. Pucel [45] a via hole ground in microstrip is a series of a resistance and an inductance. The given model for a cylindrical via hole has been verified numerically and experimentally for a range of .

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whence is the via length (substrate height) and the via's radius.

(11.233) |

with

(11.234) |

The relationship for the via resistance can be used as a close approximation and is valid independent of the ratio of the metalization thickness to the skin depth. In the formula denotes the specific resistance of the conductor material.

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